Cluster tools eliminate cross-contamination in multi-layer thin film structures and allow the production of high-quality electronic devices. Each MVSystems module as described below is controlled independently allowing simultaneous deposition in all chambers.

Vacuum: High vacuum (HV).

Substrate size: 30cmx40cm.

Modules:

• PECVD: RF, VHF and pulsed (modulated) RF plasma.
• Sputtering (ITO, AZO, ZnON, metals, etc) with oscillation.
• Park station with heating capability
• Isolation and Transfer Zone (ITZ) with robotic arm (8 port locations)
• Load lock with the following options:
  • single substrate capability.
  • multi-substrate capability.
• In-situ characterization module
• Co-joining of cluster tools allows expansion and higher throughput.

Control: Computer controlled with easy to use HMI and data logging.

Systems guarantees are defined in the contract and include*:

• Base pressure on each chamber
• Temperature calibration
• Uniformity and opto-electronic properties for each material defined in the contract
• Functionality of all systems

* These are demonstrated during the Factory (or First) acceptance test (FAT) and Site (or Second) Acceptance Tests (SAT)